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lite-on dcc release lite-on technology corp. / optoelectronics no.90,chien 1 road, chung ho, new taipei city 23585, taiwan, r.o.c. tel: 886-2-2222-6181 fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto through hole lamp product data sheetLTL1KHKSD-071A spec no.: ds20-2004-170effective date: 06/09/2004revision: - bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y features * high luminous intensity output. * low power consumption. * high efficiency. * versatile mounting on p.c. board or panel. * i.c. compatible/low current requirement. * 3.1 mm diameter package. package dimensions part no. lens source col or ltl1khksd - 071a amber diffused alingap yellow notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25mm(.010") unless otherwise noted. 3. protruded resin under flange is 1.0mm(.04") max. 4. lead spacing is measured wh ere the leads emerge from the package. 5. specifications are subject to change without notice. part no. : ltl1khksd - 071a page : 1 of 1 1 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y absolute maximum ratings at t a =25 parameter maximum rating unit power di ssipation 75 mw peak forward current (1/10 duty cycle, 0.1ms pulse width) 60 ma dc forward current 30 ma derating linear from 50 c 0.4 ma/ c reverse voltage 5 v operating temperature range - 40 c to + 100 c storage temperature range - 55 c to + 100 c lead soldering temperature [1.6mm(.063") from body] 260 c for 5 seconds part no. : ltl1khksd - 071a page : 2 of 1 1 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y electrical / optical characteristics at t a =25 parameter symbol min. typ. max. unit test condition luminous intensity i v 140 2 40 mcd i f = 20ma note 1 viewing angle 2 1/2 75 deg note 2 (fig.5) peak emission wavelength p 591 nm measurement @peak (fig.1) dominant waveleng th d 590 nm note 4 spectral line half - width ? 15 nm forward voltage v f 2.05 2.4 v i f = 20ma reverse current i r 100 a v r = 5v capacitance c 40 pf v f = 0 , f = 1mhz note: 1. luminous intensity is measured with a light s ensor and filter combination that approximates the cie eye - response curve. 2. 1/2 is the off - axis angle at which the luminous intensity is half the axial luminous intensity. 3. iv classification code is marked on each packing bag . 4. the dominant wavelength, d is derived from the cie chromaticity diagram and represents the single wavelength which defines the color of the device. part no. : ltl1khksd - 071a page : 3 of 1 1 bns - od - c131 /a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y typical electrical / optical characteristics curves (25 ambient temperature unless otherwise noted) part no. : ltl1khksd - 071a page : 4 of 1 1 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y features * compatible with radial lead automatic ins ertion equipment. * most radial lead plastic lead lamps available packaged in tape and folding. * 5mm (0.197") formed lead spacing available. * folding packaging simplifies handling and testing. reel packaging is available by removing suffix a on option . package dimensions specification item symbol minimum maximum mm inch mm inch tape feed hole diameter d 3.8 0.149 4.2 0.165 component lead pitch f 4.8 0.188 5.8 0.228 front to rear deflection h -- -- 2.0 0.078 height of seating plane h 15.5 0.610 16.5 0.649 feed hole to bottom of component h1 18.5 0.728 20.5 0.807 seating plane to top of component h3 8.0 0.315 9.0 0.354 lead length after component height l w0 11.0 0.433 feed hol e pitch p 12.4 0.488 13.0 0.511 lead location p1 3.15 0.124 4.55 0.179 center of component location p2 5.05 0.198 7.65 0.301 total taped thickness t -- -- 0.90 0.035 feed hole location w0 8.5 0.334 9.75 0.384 adhesive tape width w1 14.5 0.57 1 15.5 0.610 adhesive tape position w2 0 0 3.0 0.118 tape width w3 17.5 0.689 19.0 0.748 part no. : ltl1khksd - 071a page : 5 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y packing spec 2 500 pcs per inner carton 10 inner carton s per outer carton total 25 000 pcs per outer carton in every shipping lot, only the last pack will be non - full packing part no. : ltl1khksd - 071a page : 6 of 11 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y bin code list for reference lumi nous intensity unit : mcd @20ma bin code min. max. gh 140 240 jk 240 400 lm 400 680 note: tolerance of each bin limit is 15% dominant wavelength unit : nm @20ma bin code min. max. h14 582.0 584.0 h15 584.0 58 6.0 h16 586.0 588.0 h17 588.0 590.0 h18 590.0 592.0 h19 592.0 594.0 h20 594.0 596.0 note: tolerance of each bin limit is 1nm part no. : ltl1khksd - 071a page : 7 of 1 1 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y cautions 1. application the leds described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).consult liteons sales in advance for information on applications in which exceptional reliabili ty is required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 2. storage the storage am bient for the leds should not exceed 30c temperature or 70% relative humidity. it is recommended that leds out of their original packaging are used within three months. for extended storage out of their original packaging, it is recommended that the leds be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient. 3. cleaning use alcohol - based cleaning solvents such as isopropyl alcohol to clean the leds if necessary. 4. lead forming & assembly during lead forming, th e leads should be bent at a point at least 3mm from the base of led lens. do not use the base of the lead frame as a fulcrum during forming. lead forming must be done before soldering, at normal temperature. during assembly on pcb, use minimum clinch forc e possible to avoid excessive mechanical stress. 5. soldering when soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point. dipping the lens into the solder must be avoided. do not apply any external stres s to the lead frame during soldering while the led is at high temperature. recommended soldering conditions : soldering iron wave soldering temperature soldering time 300c max. 3 sec. max. (one time only) pre - heat pre - heat time solder w ave soldering time 100c max. 60 sec. max. 260c max. 10 sec. max. note: excessive soldering temperature and/or time might result in deformation of the led lens or catastrophic failure of the led. ir reflow is not suitable process for throu gh hole type led lamp product. part no. : ltl1khksd - 071a page : 8 of 1 1 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y 6. drive method an led is a current - operated device. in order to ensure intensity uniformity on multiple leds connected in parallel in an applica tion, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each led as shown in circuit a below. circuit model a circuit model b (a) recommended circuit (b) the brightness of each led might appear different due to the differences in the i - v characteristics of those leds 7. esd (electrostatic discharge) static electricity or power surge wi ll damage the led. suggestions to prevent esd damage: ? use a conductive wrist band or anti - electrostatic glove when handling these leds ? all devices, equipment, and machinery must be properly grounded ? work tables, storage racks, etc. should be properly gro unded ? use ion blower to neutralize the static charge which might have built up on surface of the leds plastic lens as a result of friction between leds during storage and handing part no. : ltl1khksd - 071a page : 9 of 1 1 bns - od - c131/a4 led led
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y suggested checking list : training and certification 1. everyone working in a static - safe area is esd - certified? 2. training records kept and re - certification dates monitored? static - safe workstation & work areas 1. static - safe workstation or work - areas have esd signs? 2. all surfaces and objects at all static - safe workstation and within 1 ft measure less than 100v? 3. all ionizer activated, positioned towards the units? 4. each work surface mats grounding is good? personnel grounding 1. every person (including visitors) handling esd sensitive (esds) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 2. if conductive footwear used, conductive flooring also present where operator stand or walk? 3. garmen ts, hairs or anything closer than 1 ft to esd items measure less than 100v*? 4. every wrist strap or heel strap/conductive shoes checked daily and result recorded for all dls? 5. all wrist strap or heel strap checkers calibration up to date? note: *50v for blue led. device handling 1. every esds items identified by eia - 471 labels on item or packaging? 2. all esds items completely inside properly closed static - shielding containers when not at static - safe workstation? 3. no static charge gene rators (e.g. plastics) inside shielding containers with esds items? 4. all flexible conductive and dissipative package materials inspected before reuse or recycle? others 1. audit result reported to entity esd control coordinator? 2. corrective actio n from previous audits completed? 3. are audit records complete and on file? part no. : ltl1khksd - 071a page : 10 of 1 1 bns - od - c131/a4
lite - on technology corporation p r o p e r t y o f l i t e - o n o n l y 8 . reliability test classification test item test condition reference standard e ndurance test operation life ta= under room temperature as per data sheet maximum rating * test time= 1000hrs ( - 24hrs,+72hrs) mil - std - 750d:1026 (1995) mil - std - 883d:1005 (1991) jis c 7021:b - 1 (1982) high temperature high humidity storage ta= 655 rh= 90 95% test time= 240hrs2hrs mil - std - 202f: 103b(1980) jis c 7021 : b - 11(1982) high temperature high humidity reverse bias ta= 655 rh= 90 95% vr=5v test time = 500hrs ( - 24hrs, +48hrs) jis c 7021 : b - 11(1982) high tempera ture storage ta= 1055 * test time= 1000hrs ( - 24hrs,+72hrs) mil - std - 883d:1008 (1991) jis c 7021:b - 10 (1982) low temperature storage ta= - 555 * test time=1000hrs ( - 24hrs,+72hrs) jis c 7021:b - 12 (1982) environmental test temperature cycling 10 5 25 - 55 25 30mins 5mins 30mins 5mins 10 cycles mil - std - 202f:107d (1980) mil - std - 750d:1051(1995) mil - std - 883d:1010 (1991) jis c 7021: a - 4(1982) thermal shock 105 5 - 55 5 10mins 10mins 10 cycles mil - std - 202f:1 07d(1980) mil - std - 750d:1051(1995) mil - std - 883d:1011 (1991) solder resistance t.sol = 260 5 dwell time= 10 1secs mil - std - 202f:210a(1980) mil - std - 750d:2031(1995) jis c 7021: a - 1(1982) solderability t. sol = 230 5 dwell time= 5 1secs mil - std - 202f:208d(1980) mil - std - 750d:2026(1995) mil - std - 883d:2003(1991) jis c 7021: a - 2(1982) 9. others the appearance and specifications of the product may be modified for improvement, without prior notice. part no. : ltl1khksd - 071a pa ge : 1 1 of 11 bns - od - c131/

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